Tag: silicon photonics


  • GUC and Ayar Labs Partner to Accelerate Co-Packaged Optics for Hyperscalers

    GUC and Ayar Labs Partner to Accelerate Co-Packaged Optics for Hyperscalers

    Strategic Alliance to Bring Co-Packaged Optics to Scale Global Unichip Corp. (GUC), a leading Advanced ASIC company, and Ayar Labs, a pioneer in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic partnership aimed at integrating CPO technology into hyperscale data centers. This collaboration targets the rapid deployment of high-bandwidth, low-latency interconnects that…

  • The AI Boom Accelerates the Race for Chip Networking Speed

    The AI Boom Accelerates the Race for Chip Networking Speed

    The AI Boom and the Need for Speed in Chip Networking The AI surge powering modern data centers is not just about more GPUs or larger training sets; it’s about how quickly data can move between chips. As silicon valley pivots from traditional workloads to AI-first architectures, chip networking—the intricate web that connects processors, memory,…

  • The AI Boom Drives a Breakneck Push in Chip Networking

    The AI Boom Drives a Breakneck Push in Chip Networking

    AI’s Demand Powers a Breakneck Race in Chip Networking The race to build faster, more energy-efficient AI data centers is reshaping the backbone of modern tech: chip networking. As artificial intelligence models grow in size and complexity, the demand for rapid, reliable data movement between processors, memory, and accelerators has never been higher. The result…

  • The AI Boom Accelerates Chip Networking Innovation

    The AI Boom Accelerates Chip Networking Innovation

    The AI Boom Raises the Bar for Chip Networking The surge in artificial intelligence workloads is redefining how the silicon economy thinks about connections. As data centers scale up to train and infer models at unprecedented speeds, the demand for faster, more efficient interconnects between chips has become a top priority for both established players…

  • Advantest Calls for Papers for VOICE 2026 Developer Conference in Scottsdale

    Advantest Calls for Papers for VOICE 2026 Developer Conference in Scottsdale

    Advantest Invites Global Submissions for VOICE 2026 in Scottsdale Advantest Corporation has issued a global call for papers for VOICE 2026, its premier developer conference dedicated to semiconductor test technology. The event will take place in Scottsdale, Arizona, at the Fairmont Scottsdale Princess from May 18–20, 2026. The conference centers on Advantest’s V93000 and T2000…

  • Advantest VOICE 2026: Call for Papers Opens for Scottsdale Conference

    Advantest VOICE 2026: Call for Papers Opens for Scottsdale Conference

    Overview Advantest Corporation has announced a global call for papers for VOICE 2026, the company’s flagship developer conference. The event will take place in Scottsdale, Arizona, at the Fairmont Scottsdale Princess, from May 18–20, 2026. VOICE is dedicated to advancing semiconductor test technology and serves as a key gathering for users, partners, and engineers involved…

  • Advantest Seeks Innovations at VOICE 2026 Developer Conference Call for Papers

    Advantest Seeks Innovations at VOICE 2026 Developer Conference Call for Papers

    Advantest Opens Global Call for Papers for VOICE 2026 Developer Conference Advantest Corporation, a leading supplier of semiconductor test equipment, has issued a global call for papers for VOICE 2026, the company’s premier developer conference. The event is set for May 18–20, 2026 at the Fairmont Scottsdale Princess in Scottsdale, Arizona. VOICE has long served…