Tag: N3P


  • Xiaomi’s Xring O2 to Use TSMC’s 3nm N3P Process, Skipping 2nm

    Xiaomi’s Xring O2 to Use TSMC’s 3nm N3P Process, Skipping 2nm

    Overview: Xiaomi’s Flagship Shift to 3nm Industry whispers confirm Xiaomi’s second-generation in-house flagship mobile processor, the Xring O2, will be manufactured on TSMC’s 3-nanometre N3P process rather than leveraging the company’s latest 2-nanometre technology. The decision follows an industry-wide assessment of yield, cost, and time-to-market, with analysts signaling that the 3nm node can offer a…

  • Xiaomi’s Xring O2 to Use TSMC 3nm N3P: Why the 2nm Skip Makes Sense

    Xiaomi’s Xring O2 to Use TSMC 3nm N3P: Why the 2nm Skip Makes Sense

    Overview: A strategic move to the 3nm frontier Xiaomi is reportedly advancing its second-generation in-house flagship mobile processor, the Xring O2, using TSMC’s 3-nanometer N3P process. This decision to bypass the 2-nanometer node is drawing attention from industry analysts who question whether the 3nm option will provide a more reliable path to market and better…

  • Xiaomi’s Xring O2 Chooses TSMC 3nm Over 2nm: What It Means for Flagship Phones

    Xiaomi’s Xring O2 Chooses TSMC 3nm Over 2nm: What It Means for Flagship Phones

    Overview: A Strategic Move to the 3nm Frontier Industry insiders report that Xiaomi’s second-generation in-house flagship mobile processor, the Xring O2, will be manufactured on TSMC’s 3-nanometer N3P process rather than the latest 2-nanometer node. The decision to bypass the 2nm technology is framed as a strategic trade‑off between time-to-market, yield, and real-world gains in…

  • TSMC Surges Ahead: 3nm and 5nm Chip Production to 2026

    TSMC Surges Ahead: 3nm and 5nm Chip Production to 2026

    TSMC Hits Full Capacity for 3nm and 5nm Through 2026 Taiwan Semiconductor Manufacturing Company (TSMC) is confronting record demand for its most advanced nodes, with industry outlets reporting near-maximum utilization of its 3-nanometer and 5-nanometer production lines. Ctee, a Taiwanese tech portal cited by WccfTech, notes that the company’s fabs are already operating at high…

  • TSMC Fully Loaded with 3nm and 5nm Capacity by 2026

    TSMC Fully Loaded with 3nm and 5nm Capacity by 2026

    TSMC Fully Loaded: 3nm and 5nm Capacity Pushes into 2026 Taiwan Semiconductor Manufacturing Company (TSMC) is confronting record demand for its 3nm and 5nm process technologies, according to WccfTech, citing Taiwan’s Ctee portal. The company’s production lines are already operating at high intensity, and forecasts point to near 100% utilization in the first half of…